Product Description

Copper Oxide sputtering target

Composition: Cu2O, CuO

Purity: 99.9%

Shape: Discs, disks, step disk, delta, plate, sheets or made per drawing

Diameter: 355.6mm (14") max.

Single piece Size: Length: <500mm, Width: <250mm, Thickness: >1mm, if larger size than this, we can do it as Tiles joint by 45 degree or 90 degree

Made sputtering targets method: hot pressing (HP), hot/cold isostatic pressing (HIP, CIP), and vacuum melting, vacuum sintering

Used for copper and copper alloy the preparation of the solution. Electrical appliance industry of the rectifier plating. Is also used in some ceramic and enamel of coloring​

We have only listed the more popular material. Please feel free contact us with any special requirements at any times, we will try to get back for you ASAP.

specification︰ Composition: Cu2O, CuO
Purity: 99.9%
Shape: Discs, disks, step disk, delta, plate, sheets or made per drawing
Diameter: 355.6mm (14") max.
Single piece Size: Length: <500mm, Width: <250mm, Thickness: >1mm, if larger size than this, we can do it as Tiles joint by 45 degree or 90 degree

Label︰ Copper Oxide sputtering target